GELID Solutions has introduced a new high-performance thermal paste, GC-5 Extreme, aimed at modern systems with high heat dissipation – from gaming PCs to servers and AI platforms.
What’s new in GC-5 Extreme
The new thermal paste is based on a silicone polymer with the addition of heat-conducting particles. The manufacturer claims that it provides more efficient heat dissipation and stable operation of components even under maximum load.
Key features include:
- Thermal conductivity: 4 W/m·K
- Very low thermal resistance: ≤ 0.053 °C·cm²/W
- Layer thickness (BLT): about 20 μm
- Operating temperature range: -40°C to +150°C
Such parameters allow for efficient heat transfer from the chip to the cooling system, reducing the risk of overheating.
Who is this thermal paste for?
GC-5 Extreme is positioned as a solution for:
- processors (CPU) and graphics cards (GPU)
- server systems and data centers
- AI and machine learning
- gaming and overclocking builds
That is, this is a universal option for both home users and professional systems.
How is it better than previous solutions?
Compared to previous generations of thermal pastes, the new GC-5 focuses on:
- thinner coating layer
- better contact with the chip surface
- stable operation at high temperatures
Previously, GC-Extreme series models had already demonstrated high results in tests and could outperform competitors in terms of temperature performance.
Conclusion
GC-5 Extreme is a state-of-the-art thermal paste designed to maximize cooling efficiency under high load conditions. It is suitable for both PC upgrades and high-performance system builds where temperature control is critical.