GELID Solutions has introduced an innovative cooling solution – the HeatPhase Ultra 2 thermal pad, which can become an alternative to classic thermal pastes.
The new product uses phase transition (PCM) technology, which allows for stable contact between the chip and the radiator even at high temperatures.
Main characteristics
HeatPhase Ultra 2 is not just an ordinary thermal pad, but a high-tech interface for heat transfer:
- Thermal conductivity: ≈ 8.5 W/m·K
- Thickness: 0.2 mm
- Phase transition temperature: ~45°C
- Operating range: -50°C to +125°C
- Non-conductive (component safe)
How it works
The main feature is the phase-change material.
When heated to approximately 45°C, the gasket becomes more plastic and fills in the micro-unevenness between the processor and the cooler. This provides better contact than conventional hard gaskets.
After cooling, the material stabilizes and retains its shape, without drying out or degrading over time.
What is it suitable for?
HeatPhase Ultra 2 can be used for:
- processors (CPU)
- video cards (GPU)
- laptops and compact systems
- servers and workstations
Separate versions for Intel and AMD with corresponding sizes are also available.
Advantages over thermal paste
According to the manufacturer’s statements and tests:
- can show similar or even better temperatures than top-end pastes
- does not require precise application
- does not dry out over time
- easy to install and remove
In tests with the Ryzen 9 7950X, the difference with thermal paste was about 2°C in favor of the gasket, which is at the level of top-end solutions.
Conclusion
HeatPhase Ultra 2 is an interesting step in the development of cooling systems.
It combines the ease of use of thermal pads with the effectiveness of thermal paste, making it a good option for both beginners and enthusiasts.